光电信息大讲堂第151期: 三维集成的过去和未来

作者: 时间:2020-04-16 点击数:

主    题: 三維集成的過去和未來( 3-D Integration: Past and Future
时    间: 2019 年 9月 2 日 15 : 00 - 16: 00
地    点:
西一樓一樓大會議室
報告人:
张国飙   博士, 南方科技大学
邀請人: 余国义、王超 研究员

報告摘要:


在7nm節點上,晶體管沒有多少代可以進一步向前演進了。隨著未來晶體管的尺寸縮小,這種趨勢預計在2026-2030年左右停滯。當前三維集成被認爲是最有希望的候選方案之一。三維集成可以在兩個層次上進行:集成電路(IC)層次(即單片3D-IC)和封裝層次(即3D封裝)。在本次演講中涵蓋了工業界成熟的單片3D-IC和3D封裝的介紹。也將討論單片3D-IC和3D封裝開發過程中的多個重要裏程碑。

At the 7nm node, transistors do not have many generations to go. As future scaling of transistors is expected to become stalled around year 2026-2030, 3-D Integration is now considered as one of the most promising candidates. The 3-D integration can be carried out at two levels: integrated circuit (IC) level (i.e. monolithic 3D-IC) and packaging level (i.e. 3D-packaing). In this talk, both monolithic 3D-IC and 3D-packaing will be covered by industrial veterans. Several important milestones during the development of the monolithic 3D-IC and 3D-packaing will be discussed.

報告人介紹:

张国飙 博士 研究教授 2019年加入南方科技大学深港微电子学院。1995年在伯克利大学获得博士学位,导师是加州大学伯克利分校名誉教授、台积电荣誉教授Chenming HU(胡正明)。他在德州仪器公司工作了五年,后来创办了3D-ROM公司。张博士是三维内存和三维计算的发明者。他拥有超过100项专利,其中大部分是美国专利。英特尔的3D Xpoint和YMTC的Xtacking使用了张博士的专利技术

Dr. Guobiao ZHANG is a research professor in Hong-Kong Microelectronics College of  Southern University of Science and Technology at Shenzhen since 2019. He received Ph.D. degree from Berkeley under Chenming HU (University of California, Berkeley Professor Emeritus and TSMC Distinguished Professor Emeritus) in 1995. He worked at Texas Instrument for five years before started 3D-ROM INC. Dr. Zhang is an inventor of 3-D memory and 3-D computation. He owns over 100 hundred patents, most of which are the U.S. patents. Intel’s 3D-XPoint and YMTC’s Xtacking used Dr. Zhang’s patented technologies.


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